Engineer R&D TGV

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Teamin Leoben, Austria, we are looking for a passionate

Engineer R&D

In your role, you will support the design and development of new products by contributing to key technical activities within R&D projects. You will execute assigned engineering tasks, collaborating with cross-functional teams, and actively evaluating and adopting external technologies when needed to enable successful product development.

• Develop and optimize Through Glass Via (TGV) formation processes including laser modification and etching
• Develop and optimize Singulation processes
• Establish inspection and metrology methods for TGV characterization and singulation quality
• Support downstream processes (seed, plating, CMP, reliability) by ensuring TGV quality meets integration requirements
• Support the technical design and development of new products by executing assigned tasks and contributing to meeting AT&S's performance and quality standards
• Conduct research activities and perform experiments to support the development of solutions aimed at improving product performance and manufacturing processes
• Analyze experimental data and provide input and recommendations to enhance product performance and improve process efficiency

• Bachelor's or master's degree in Electrical engineering, Materials Science, Chemical Engineering, Mechanical Engineering, Optics/Photonics, or a related field
• 3+ years of experience in laser micro-machining, glass material processing, or semiconductor packaging processes, in R&D or product development roles
• Practical experience with laser systems and/or glass wet etching processes
• Basic understanding of glass mechanical properties, including crack behavior and heat-affected zone control
• Hands-on experience with analytical tools regarding inspection and metrology
• Experience in advanced IC substrates, interposers, or packaging R&D is a plus
• Strong technical aptitude with willingness to develop problem-solving skills further
• Effective collaboration and communication skills
• Fluency in English

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S' success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry ( ), employment group E-F, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.

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